SWCS049J datasheet(12/119 Pages) TI1

12 / 119 page

TPS659110, TPS659112, TPS659113

TPS659114, TPS659118, TPS6591133

SWCS049Q – JUNE 2010 – REVISED MARCH 2016

www.ti.com

Submit Documentation Feedback

Product Folder Links: TPS659110 TPS659112 TPS659113 TPS659114 TPS659118 TPS6591133

Specifications

(1)

VCC7 should be connected to highest supply that is connected to device VCCx pin.

Exception: VCC4, VCC5, and V5IN inputs can be higher than VCC7. VCCS can be higher than VCC7 if VMBBUF_BYPASS = 0 (buffer

is enabled).

5.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Input voltage range

on pins or balls

VCC1, VCC2, VCCIO, VCC5, VCC7, VCCS, VCC4,

VBACKUP

2.7

3.8

5.5

VCC3

1.7

3.8

5.5

VDDIO

1.65

1.8/3.3

3.45

VCC6

1.4

3.3

3.6

V5IN

4.5

6.5

VBST

–0.1

3.45

SW (<30% of repetitive period)

–1

TRIP, VFB

–0.1

6.5

PWRON

3.8

5.5

SDA_SDI, SCL_SCK, EN2, EN1, SLEEP, INT1,

CLK32KOUT

1.65

VDDIO

3.45

PWRHOLD, HDRST

1.65

VRTC

5.5

Input voltage range

on balls

GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6,

GPIO7, GPIO8, PWRDN

1.65

VRTC

5.5

VCCS

5.5

Ambient temperature

–40

°C

Junction temperature, TJ

–40

125

Lead temperature (soldering, 10 s)

260

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics, SPRA953.

(2)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

5.4

Thermal Information

THERMAL METRIC(1)

ZRC (BGA)

UNIT(2)

98 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

SWCS049J 데이터시트(PDF) 12 Page - Texas Instruments

SWCS049J 데이터시트(HTML) 12 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

데이터시트 다운로드

링크 URL