LM137, LM337-N

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SNVS778E – MAY 1999 – REVISED JANUARY 2016

10.3 Thermal Considerations

10.3.1 Heatsinking SOT-223 Package Parts

The SOT-223 DCY packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the

heat sinking ability of the plane and PCB, solder the tab of the package to the plane.

Figure 19 and Figure 20 show the information for the SOT-223 package. Figure 20 assumes a

for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.

Figure 19.

See AN-1028, SNVA036, for power enhancement techniques to be used with the SOT-223 package.

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Product Folder Links: LM137 LM337-N