Low Noise Amplifier

1400 - 2000 MHz

Rev. V2

MAALSS0048

6

6

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6

Part

Value

Purpose

C1

47 pF

DC Block

C2

470 pF

By-Pass

L1

10 nH

Tuning

L2

3.9 nH

Tuning

L3

22 nH

RF Choke

R1

See note 11

Current control

C3

470 pF

By-Pass

10. All external circuitry parts are readily available, low cost

surface mount components (.060 in. x .030 in. or .080 in.

x .050 in.)

11. Pin 5 allows use of an external resistor to ground for

optional, higher current.

For IDD ~ 5 mA, R1 = 150 Ω;

IDD ~ 6.5 mA, R1 = 120 Ω;

IDD ~ 20 mA, R1 = 27 Ω.

Functional Schematic

Data for 1400 - 1520 MHz Operation

RF

Input

RF

Output

C1

L1

R1

(See note 11)

L2

2,4

3

6

1

5

C2

C3

L3

Cross Section View

The PCB dielectric between RF traces and RF ground layers

should be chosen to reduce RF discontinuities between 50 Ohm

lines and package pins. M/A-COM recommends an FR-4 di-

electric thickness of 0.008” (0.20 mm) yielding a 50 Ohm line

width of 0.015” (0.38 mm). The recommended RF metalization

thickness is 1 ounce copper.

RF Traces & Components

RF Ground

DC Routing

Customer Defined

Recommended PCB Configuration

Layout View

Pin 1