MICROWAVE CORPORATION

8 - 259

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

8

HMC462LP5

v00.0304

GaAs PHEMT MMIC

LOW NOISE AMPLIFIER, 2.0 - 20.0 GHz

Outline Drawing

NOTES:

1. ALL DIMENSIONS IN INCHES [MILLIMETERS]

2. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS

3. DIE THICKNESS IS 0.004 (0.100)

4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE

5. BACKSIDE METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. BOND PAD METALIZATION: GOLD

Pad Number

Function

Description

Interface Schematic

5

RFIN

This pad is AC coupled and matched to 50 Ohms

from 2.0 - 20.0 GHz.

21

RFOUT

This pad is AC coupled and matched to 50 Ohms

from 2.0 - 20.0 GHz.

30

Vdd

Power supply voltage for the amplifier.

External bypass capacitors are required.

Ground

Paddle

GND

Ground paddle must be connected to RF/DC ground.

1-4, 6-20, 22-

29, 31, 32

N/C

No connection. These pins may be connected to RF ground.

Performance will not be affected.

Pad Descriptions