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CMS17 데이터시트(PDF) 3 Page - Toshiba Semiconductor

부품명 CMS17
상세설명  TOSHIBA Schottky Barrier Diode
PDF  5 Pages
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제조업체  TOSHIBA [Toshiba Semiconductor]
홈페이지  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

CMS17 데이터시트(HTML) 3 Page - Toshiba Semiconductor

  CMS17_13 Datasheet HTML 1Page - Toshiba Semiconductor CMS17_13 Datasheet HTML 2Page - Toshiba Semiconductor CMS17_13 Datasheet HTML 3Page - Toshiba Semiconductor CMS17_13 Datasheet HTML 4Page - Toshiba Semiconductor CMS17_13 Datasheet HTML 5Page - Toshiba Semiconductor  
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CMS17
2013-11-01
3
Instantaneous forward voltage vF
(V)
iF – vF
Average forward current IF (AV) (A)
PF (AV) – IF (AV)
Average forward current IF (AV) (A)
Ta max – IF (AV)
Average forward current IF (AV) (A)
Tℓ max – IF (AV)
0.0
0
0.2
1.2
0.8
1.2
2.0
3.2
0.4
0.8
0.4
1.6
0.6
α = 60°
120°
DC
180°
1.0
0.0
0
40
160
0.8
1.2
2.0
3.2
20
60
120
100
0.4
1.6
80
α = 60°
120°
DC
180°
140
0.0
0
40
160
0.8
1.2
2.0
3.2
20
60
120
100
0.4
1.6
80
α = 60°
120°
DC
180°
140
2.4
2.8
2.4
2.8
2.4
2.8
10
0
0.3
0.1
0.2
0.8
0.6
0.4
0.5
0.7
1
0.1
0.01
0.3
0.03
3
Tj = 150°C
75°C
25°C
125°C
Pulse test
360°
0°
Rectangular
waveform
α
Conduction angle
α
Device mounted on a ceramic board:
board size: 50 mm
× 50 mm
soldering land:
2 mm
× 2 mm
board thickness:
0.64 t
360°
0°
α
VR = 15 V
IF (AV)
Conduction
angle
α
Rectangular
waveform
360°
0°
α
VR = 15 V
IF (AV)
Conduction
angle
α
Rectangular
waveform
Time t (s)
rth (j-a) – t
1000
1
100
10
0.001
1000
0.01
0.1
100
10
1
Device mounted on a glass-epoxy board:
board size: 50 mm
× 50 mm
Soldering land: 2.1 mm
× 1.4 mm
board thickness: 1.6 t
Device mounted on a glass-epoxy board:
board size: 50 mm
× 50 mm
Soldering land: 6.0 mm
× 6.0 mm
board thickness: 1.6 t
Device mounted on a ceramic board:
board size: 50 mm
× 50 mm
Soldering land: 2.0 mm
× 2.0 mm
board thickness: 0.64 t
3
5
30
50
300
500
0.003
0.03
0.3
3
30
300



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