Rev 2.1

vicorpower.com

Page 13 of 14

09/2015

800 927.9474

P036F048T12AL

Configuration Options

RECOMMENDED LAND PATTERN

(NO GROUNDING CLIPS)

TOP SIDE SHOWN

RECOMMENDED LAND PATTERN

(With GROUNDING CLIPS)

TOP SIDE SHOWN

NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE

FREE OF COPPER, ALL PCB LAYERS.

2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],

THIS PROVIDES 7.00 [0.275] COMPONENT

EDGE-TO-EDGE SPACING, AND 0.50 [0.020]

CLEARANCE BETWEEN VICOR HEAT SINKS.

(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],

THIS PROVIDES 8.50 [0.334] COMPONENT

EDGE-TO-EDGE SPACING, AND 2.00 [0.079]

CLEARANCE BETWEEN VICOR HEAT SINKS.

ACTUAL LAND PATTERN MAY DIFFER.

DIMENSIONS FROM EDGES OF LAND PATTERN

TO PUSH-PIN HOLES WILL BE THE SAME FOR

ALL FULL SIZE VI CHIP PRODUCTS.

4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.

5. UNLESS OTHERWISE SPECIFIED:

DIMENSIONS ARE MM [INCH].

TOLERANCES ARE:

X.X [X.XX] = ±0.3 [0.01]

X.XX [X.XXX] = ±0.13 [0.005]

6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)

SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND

DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.

Figure 23 — Hole location for push pin heat sink relative to VI Chip