MB91F528 datasheet(235/241 Pages) SPANSION

235 / 241 page

D at aS h ee t

176-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

24.0 × 24.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Code

(Reference)

P-LQFP-0176-2424-0.5 0

176-pin plastic LQFP

(FPT-176P-M07)

Details of "A" part

0°~8°

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.25(.010)

(Stand off)

(.004±.004)

0.10±0.10

1.50

+0.20

–0.10

+.008

–.004

.059

(Mounting height)

0.08(.003)

(.006±.002)

0.145±0.055

"A"

INDEX

LEAD No.

132

133

176

0.50(.020)

0.22±0.05

(.009±.002)

0.08(.003)

*24.00±0.10(.945±.004)SQ

26.00±0.20(1.024±.008)SQ

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : Values do not include resin protrusion.

Resin protrusion is +0.25(.010)Max(each side).

Note 2) Pins width and pins thickness include plating thickness

Note 3) Pins width do not include tie bar cutting remainder.

2004-2010 FUJITSU SEMICONDUCTOR LIMITED F176013S-c-1-3

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

232

MB91F528_DS705-00016-1v0-E, March 28, 2014

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