| 전자부품 데이터시트 검색엔진 |
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LMV1012 데이터시트(PDF) 13 Page - National Semiconductor (TI) |
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LMV1012 데이터시트(HTML) 13 Page - National Semiconductor (TI) |
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13 / 15 page ![]() Physical Dimensions inches (millimeters) unless otherwise noted NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA. 4-Bump Extreme Thin micro SMD NS Package Number XPA04HLA X 1 = 0.955 mm X 2 = 1.031 mm X 3 = 0.300 mm www.national.com 13 |
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