MAX16838B datasheet(2/21 Pages) MAXIM

2 / 21 page

IN, OUT_, DRAIN to SGND ..................................-0.3V to +45V

EN to SGND...............................................-0.3V to (VIN + 0.3V)

PGND to SGND....................................................-0.3V to +0.3V

LEDGND to SGND...............................................-0.3V to +0.3V

DRV to PGND .........-0.3V to the lower of (VIN + 0.3V) and +6V

GATE to PGND .......................................................-0.3V to +6V

NDRV to PGND...................................... -0.3V to (VDRV + 0.3V)

VCC, FLT, DIM, CS, OV, CFB, to SGND.................-0.3V to +6V

RT, COMP, ISET to SGND ....................... -0.3V to (VCC + 0.3V)

DRAIN and CS Continuous Current...................................±2.5A

OUT_ Continuous Current................................................175mA

VDRV Short-Circuit Duration......................................Continuous

Continuous Power Dissipation (TA = +70ºC)

20-Pin TQFN (derate 25.6mW/ºC above +70ºC) ......2051mW

20-Pin TSSOP (derate 26.5mW/ºC above +70ºC)....2122mW

Operating Temperature Range..........................-40ºC to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range.............................-65ºC to +150°C

Soldering Temperature (reflow).......................................+260°C

TQFN

Juction-to-Ambient Thermal Resistance (θJA) ..........+39°C/W

Junction-to-Case Thermal Resistance (θJC)...............+6°C/W

TSSOP

Junction-to-Ambient Thermal Resistance (θJA) .....+37.7°C/W

Junction-to-Case Thermal Resistance (θJC)...............+2°C/W

(Note 1)

(VIN = VEN = 12V, RRT = 12.2kΩ, RISET = 15kΩ, CVCC = 1µF, VCC = VDRV = VCFB, DRAIN, COMP, OUT_, FLT = unconnected, VOV

= VCS = VLEDGND = VDIM = VPGND = VSGND = 0V, VGATE = VNDRV, TA = TJ = -40ºC to +125°C, unless otherwise noted. Typical

values are at TA = 25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Voltage Range

VIN

Internal LDO on

4.75

Input Voltage Range

VIN

VIN = VCC

4.55

5.5

Quiescent Supply Current

VDIM = 5V

3.1

Standby Supply Current

ISH

VEN = SGND (Note 3)

15.5

µA

Undervoltage Lockout

UVLOIN VIN rising, VDIM = 5V

4.3

4.55

Undervoltage Lockout Hysteresis

177

DRV REGULATOR

Output Voltage

VDRV

5.75V < VIN < 10V, 0.1mA < ILOAD < 30mA

4.75

5.25

6.5V < VIN < 40V, 0.1mA < ILOAD < 3mA

Dropout Voltage

VDO

(VIN - VDRV)

VIN = 4.75V, IOUT = 30mA

0.11

0.5

Short-Circuit Current Limit

DRV shorted to GND

VCC Undervoltage Lockout

Threshold

UVLOVCC VCC rising

3.4

4.0

4.4

VCC (UVLO) Hysteresis

123

MAX16838B

Integrated, 2-Channel, High-Brightness LED Driver

with High-Voltage Boost and SEPIC Controller

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

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