DS-CPC1908-R10

www.ixysic.com

1

Characteristics

Features

 On-Resistance



Heat Sink Applications

Applications

Approvals

Pin Configuration

Description

IXYS Integrated Circuits Division and IXYS have

combined to bring OptoMOS® technology, reliability

and compact size to a new family of high-power Solid

State Relays.

As part of this family, the CPC1908 single-pole

normally open (1-Form-A) Solid State Power Relay is

5°C/W heat sink.

The CPC1908 employs optically coupled MOSFET

isolation. The optically coupled outputs, that use

patented OptoMOS architecture, are controlled by a

highly efficient infrared LED. The combination of low

on-resistance and high load current handling

capability makes this relay suitable for a variety of high

performance switching applications.

The unique i4-PAC package pioneered by IXYS

enables Solid State Relays to achieve the highest load

current and power ratings. This package features a

unique IXYS process where the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

substrate instead of the traditional copper leadframe.

The DCB ceramic, the same substrate used in high

but also very low junction-to-case thermal resistance

(0.35 °C/W).

Ordering Information

Switching Characteristics

Parameter

Rating

Units

Blocking Voltage

60

With 5°C/W Heat Sink

No Heat Sink

8.5

3.5

On-Resistance (max)

0.3



Thermal Resistance,

Junction-to-case,



JC

0.35

°C/W

Part

Description

CPC1908J

i4-PAC Package (25 per tube)

Form-A

I

F

I

LOAD

10%

90%

t

on

t

off

CPC1908

60V Single-Pole, Normally

Open Power Relay