L6229PD datasheet(3/25 Pages) STMICROELECTRONICS

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L6229

Table 3. Recommended Operating Condition

Table 4. Thermal Data

Symbol

Parameter

Test Conditions

MIN

MAX

Unit

Supply Voltage

VSA = VSB = VS

VOD

Differential Voltage between:

VSA, OUT1, OUT2, SENSEA and

VSB, OUT3, SENSEB

VSA = VSB = VS;

VSENSEA = VSENSEB

VREF

Voltage Range at pin VREF

-0.1

VSENSE

Voltage Range at pins SENSEA

and SENSEB

(pulsed tW < trr)

(DC)

-6

-1

IOUT

DC Output Current

VSA = VSB = VS

1.4

Operating Junction Temperature

-25

125

°C

fSW

Switching Frequency

100

KHz

Symbol

Description

PDIP24

SO24

PowerSO36

Unit

Rth(j-pins)

Maximum Thermal Resistance Junction-Pins

°C/W

Rth(j-case)

Maximum Thermal Resistance Junction-Case

°C/W

Rth(j-amb)1

MaximumThermal Resistance Junction-Ambient (1)

(1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm).

°C/W

Rth(j-amb)1

Maximum Thermal Resistance Junction-Ambient (2)

(2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm).

°C/W

Rth(j-amb)1

MaximumThermal Resistance Junction-Ambient (3)

(3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm),

16 via holes and a ground layer.

°C/W

Rth(j-amb)2

Maximum Thermal Resistance Junction-Ambient (4)

(4) Mounted on a multi-layer FR4 PCB without any heat-sinking surface on the board.

°C/W

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