5

AT97SC3201

2015DS-TPM–7/04

Package Drawing

28A3 – TSSOP

2325 Orchard Parkway

San Jose, CA 95131

TITLE

DRAWING NO.

R

REV.

1/8/02

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

D

9.60

9.70

9.80

2, 5

E

8.10 BSC

E1

6.00

6.10

6.20

3, 5

A

––

1.20

A2

0.80

1.00

1.05

b

0.19

–

0.30

4

e

0.65 BSC

L

0.45

0.60

0.75

L1

1.00 REF

28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,

Thin Shrink Small Outline Package (TSSOP)

Notes:

1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in)

per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b

dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between

protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

28A3

A

L1

A

L

D

A2

E E1

e

b

Top View

Side View

End View