LM2941, LM2941C

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SNVS770I – JUNE 1999 – REVISED JANUARY 2015

10.4 Thermal Considerations

10.4.1 TO-263 Mounting

The thermal dissipation of the TO-263 package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the TAB.

The TAB on the bottom of the TO-263 package is connected to the die substrate via a conductive die attach

adhesive, and to device pin 3. As such, it is strongly recommend that the TAB area be connected to copper area

directly under the TAB that is extended into the ground plane via multiple thermal vias. Alternately, but not

recommended, the TAB may be left floating (i.e. no direct electrical connection). The TAB must not be connected

to any potential other than ground.

10.4.2 WSON Mounting

The NGN (Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in

Application Note 1187: Leadless Leadframe Package (LLP) (SNOA401). Referring to the section PCB Design

Recommendations in AN-1187, it should be noted that the pad style which should be used with the WSON

package is the NSMD (non-solder mask defined) type.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the DAP.

The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate via a conductive

die attach adhesive, and to device pin 2 and pin 7. As such, it is strongly recommend that the DAP area be

connected copper area directly under the DAP that is extended into the ground plane via multiple thermal vias.

Alternately, but not recommended, the DAP area may be left floating (i.e. no direct electrical connection). The

DAP area must not be connected to any potential other than ground.

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