A1

A2

B1

B2

B3

C2

C1

C3

A3

LM3508

SNVS494C – APRIL 2007 – REVISED MAY 2013

www.ti.com

Connection Diagram

9-Bump (Large) DSBGA

(1.514mm x 1.514mm x 0.6mm) Package Number YZR000911A

Top View

PIN DESCRIPTIONS

Pin

Name

Function

A1

PGND

Power Ground Connection.

A2

SW

Inductor connection and drain connection for both NMOS and PMOS power devices.

A3

OUT

Output capacitor connection, PMOS source connection for synchronous rectifier, and OVP sensing

node.

B1

ILED

Regulated current source input.

B2

DIM

Current source modulation input. A logic low at DIM turns off the internal current source. A logic high

B3

IN

Input voltage connection.

C1

SET

C2

EN

Enable input. A logic low at EN turns off the LM3508. A logic high turns the device on.

C3

AGND

Analog ground. Connect AGND to PGND through a low impedance connection.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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