Product Specification

Revision: C

Date: August 27, 2015

© Samtec, Inc.

Page 8

7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of

260°C.

7.5 Stencil Thickness: The stencil thickness is

.006” (0,15 mm).

7.6 Placement: Machine placement of the parts is recommended.

7.7 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers

two different types:

7.7.1

Traditional Standoffs (SO)

– Rigid design to statically support board-to-board applications. See

options here:

SO - Board Stacking Standoff

7.7.2

Jack Screw Standoffs (JSO)

– Serve same function as traditional standoffs but unique, nested

construction facilitates the mating and unmating process. This is especially helpful for multiple

connector applications where the mating and unmating forces increase with the number of connectors

used. See options here:

JSO - Jack Screw Standoffs

7.8 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through

Nitrogen gas infusion) in the reflow process to improve solderability.

designated in the EIA-364-11A standard.

8.0 ADDITIONAL RESOURCES

8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at

CES@samtec.com

8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at

SIG@samtec.com

8.3 For additional processing information, contact our Interconnect Processing Group at IPG@samtec.com

8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental

Compliance Group at PEC@samtec.com

USE OF PRODUCT SPECIFICATION SHEET

This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should

only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not

limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This

PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec

does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the

PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or

indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all

intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS

is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or

relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES

EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED.