LMP7717MASLASHNOPB datasheet(3/37 Pages) TI1

3 / 37 page

LMP7717, LMP7718

www.ti.com

SNOSAY7H – MARCH 2007 – REVISED MARCH 2013

Absolute Maximum Ratings

(1) (2)

ESD Tolerance (3)

Human Body Model

2000V

Machine Model

200V

Charge-Device Model

1000V

VIN Differential

±0.3V

Supply Voltage (V+ – V−)

6.0V

Input/Output Pin Voltage

V+ +0.3V, V−

−0.3V

Storage Temperature Range

−65°C to 150°C

Junction Temperature(4)

+150°C

For soldering specifications:

see product folder at www.ti.com/ and http://www.ti.com/lit/SNOA549

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see 5V Electrical Characteristics().

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to 125°C

Supply Voltage (V+ – V−)

−40°C ≤ TA ≤ 125°C

2.0V to 5.5V

0°C

≤ TA ≤ 125°C

1.8V to 5.5V

Package Thermal Resistance (

θJA

(2))

5-Pin SOT-23

180°C/W

8-Pin SOIC

190°C/W

8-Pin VSSOP

236°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see 5V Electrical Characteristics().

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC Board.

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