MICRO

CONTROLLER

+IN

-IN

REFS

REFF

FB

OUT

+5V

1

2

3

4

5

6

7

VHSER/VLPAR

V

-

VLSER/VHPAR

SCK/G2

SDI/G1

SDO/G0

8

9

10

11

12

13

14

V

+

LMP8358

CSB/SHDN

+3.3V

EMI

+

0.1 PF

10 PF

To Next SPI Device

LMP8358

SNOSB09B – APRIL 2010 – REVISED MARCH 2013

www.ti.com

Typical Application

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

2kV

Machine Model

200V

Charge Device

1kV

6V,

−0.3V

+IN,

−IN, OUT Pins

−0.3V

+IN,

−IN Pins

±10 mA

Storage Temperature Range

−65°C to 150°C

150°C

For soldering specifications: see product folder at www.ti.com and http://www.ti.com/lit/SNOA549.

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but for which specific performance is not ensured. For ensured specifications and the test

conditions, see Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22–A115–A (ESD MM std. of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22–C101–C (ESD FICDM std. of JEDEC).

(4)

The short circuit test is a momentary test which applies to both single-supply and split-supply operation. Continuous short circuit

operation at elevated ambient temperature can exceed the maximum allowable junction temperature of 150°C.

(5)

2

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