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25LC256TE/P 데이터시트(PDF) 14 Page - Microchip Technology |
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25LC256TE/P 데이터시트(HTML) 14 Page - Microchip Technology |
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14 / 32 page ![]() 25AA256/25LC256 DS21822G-page 14 2003-2013 Microchip Technology Inc. 4.0 PACKAGING INFORMATION 4.1 Package Marking Information T/XXXNNN XXXXXXXX YYWW 8-Lead PDIP 8-Lead SOIC (3.90 mm) XXXXYYWW XXXXXXXT NNN XXXX TYWW 8-Lead TSSOP NNN I/P 1L7 25LC256 0528 Example: Example: SN 0528 25LC256I 1L7 1L7 5LE I528 Example: 8-Lead DFN Example : XXXXXXX T/XXXXX YYWW 25LC256 I/MF 0528 1L7 NNN Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e TSSOP 1st Line Marking Codes Device Standard Rotated 25AA256 5AE 5AEX 25LC256 5LE 5LEX 8-Lead SOIC (208 mil) XXXXXXXX XXXXXXXX YYWWNNN Example: 25LC256 05281L7 3 e I/SM |
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