DSC1001AC2 datasheet(6/7 Pages) MICREL

6 / 7 page

Page 6

MK-Q-B-P-D-050610-01-9

DSC1001

1.8~3.3V

Low-Power Precision CMOS Oscillator

Board Layout (recommended)

Solder Reflow Profile

Package Dimensions

7.0 x 5.0 mm Plastic Package

MSL 1 @ 260°C refer to JSTD-020C

Ramp-Up Rate (200°C to Peak Temp)

3°C/Sec Max.

Preheat Time 150°C to 200°C

60-180 Sec

Time maintained above 217°C

60-150 Sec

Peak Temperature

255-260°C

Time within 5°C of actual Peak

20-40 Sec

Ramp-Down Rate

6°C/Sec Max.

Time 25°C to Peak Temperature

8 min Max.

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

Reflow

Cool

Time

200°C

217°C

150°C

25°C

260°C

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

Reflow

Cool

Time

200°C

217°C

150°C

25°C

260°C

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

Reflow

Cool

Time

200°C

217°C

150°C

25°C

260°C

Pin Terminal

VDD

Standby#

Output

GND

7.0±0.10 [0.276±0.004]

5.0±0.10 [0.197±0.004]

External Dimensions

5.08 [0.2]

1.2 [0.047]

1.4 [0.055]

0.85±0.05 [0.033±0.002]

Recommended Land Pattern*

1.4 [0.055]

5.08 [0.200]

units: mm [inch]

No.

0.2 [0.008]

2.6 [0.102]

0.2 [0.008]

2.2 [0.087]

3.5 [0.138]

o o

0.2 [0.008]

*Note: The center pad is not connected

internally and should be left un-

connected or tied to GND.

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