LP2953AMGWSLASH883 datasheet(4/26 Pages) TI1

4 / 26 page

LP2953QML, LP2953QML-SP

SNVS395C – NOVEMBER 2010 – REVISED APRIL 2013

www.ti.com

Absolute Maximum Ratings

(1)

Storage Temperature Range

−65°C ≤ TA ≤ +150°C

Operating Temperature Range

−55°C ≤ TA ≤ +125°C

Maximum Junction Temperature

+150°C

Lead Temp. (Soldering, 5 seconds)

260°C

Power Dissipation(2)

Internally Limited

Input Supply Voltage

−20V to +30V

Feedback Input Voltage(3)

−0.3V to +5V

Comparator Input Voltage(4)

−0.3V to +30V

Shutdown Input Voltage(4)

−0.3V to +30V

Comparator Output Voltage(4)

−0.3V to +30V

16LD CFP "WG" (device 01) (Still Air)

134°C/W

16LD CFP "WG" (device 01) (500LF/Min Air flow)

81°C/W

θJA

16LD CFP "GW" (device 02) (Still Air)

140°C/W

Thermal Resistance

16LD CFP "GW" (device 02) (500LF/Min Air flow)

90°C/W

16LD CFP "WG" (device 01)(5)

7°C/W

θJC

16LD CFP "GW" (device 02)

15°C/W

16LD CFP "WG" (device 01)

360mg

Package Weight (Typical)

16LD CFP "GW" (device 02)

410mg

ESD Rating(6)

2 KV

(1)

Abs. Max Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the

device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see Electrical

Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the

device is not operated under the listed test conditions.

(2)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),

θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.

(3)

When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped

to ground.

(4)

May exceed the input supply voltage.

(5)

The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full

advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either

metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be

calculated using

θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat

transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package

base. The stated

θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance

between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and

must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.

(6)

Human body model, 1.5 K

Ω in series with 100 pF.

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