 2015 Microchip Technology Inc.

DS20005413A-page 9

CL220

3-Lead TO-220 Package Outline (N5)

Symbol

A

A1

A2

b

b2

c

D

D1

D2

E

E1

E2

e

H1

L

L1

Q

P

Dimen-

sion

(inches)

MIN

.140 .020

.080

.100

BSC

.230 .500 .200* .100 .139

NOM

-

-

-

.027 .057

-

-

-

-

-

-

-

-

-

-

-

-

.024

.030

.270 .580

.250

.135 .161

JEDEC Registration TO-220, Variation AB, Issue K, April 2002.

Drawings not to scale.

L

A2

A

e

View

B

12

3

D

D1

Q

4

E2

E

Φ

P

Seating

Plane

A1

A

A

Chamfer

Optional

H1

E

D2

Thermal

Pad

Front View

Side View

View A - A

L1

b

b2

1

2

3

E1

View B

c

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.