LPV511 datasheet(2/21 Pages) TI1

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LPV511

SNOSAG7C – AUGUST 2005 – REVISED MARCH 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body

2 KV

ESD Tolerance(3)

Machine Model

200V

VIN Differential

2.1V

Supply Voltage (V+ - V−)

13.2V

Voltage at Input/Output pins

V+ +0.3V, V−

−0.3V

Storage Temperature Range

−65°C to +150°C

Short Circuit Duration

See(4)

Junction Temperature(5)

+150°C

Infrared or Convection (20 sec)

235°C

Soldering Information

Wave Soldering Lead Temp. (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model: 1.5 k

Ω in series with 100 pF. Machine Model: 0Ω in series with 200 pF.

(4)

Output short circuit duration is infinite for V+ < 6V at room temperature and below. For V+ > 6V, allowable short circuit duration is 1.5 ms.

(5)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to +85°C

Supply Voltage (V+ – V−)

2.7V to 12V

Package Thermal Resistance (

θJA)

(2)

5-Pin SC70

456°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

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