P89LPC901FD datasheet(52/55 Pages) PHILIPS

52 / 55 page

Philips Semiconductors

P89LPC901/902/903

8-bit microcontrollers with two-clock 80C51 core

Product data

Rev. 04 — 21 November 2003

52 of 55

9397 750 12293

14.4 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales ofﬁce.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[3]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

[4]

Hot bar soldering or manual soldering is suitable for PMFP packages.

[5]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[6]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[7]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[8]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[9]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

Table 16:

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Mounting

Package[1]

Soldering method

Wave

Reﬂow[2]

Dipping

Through-hole

mount

DBS, DIP, HDIP, RDBS,

SDIP, SIL

suitable[3]

−

suitable

Through-hole-

surface mount

PMFP[4]

not suitable

νοτ

συιταβλε

−

Surface mount

BGA, LBGA, LFBGA,

SQFP, SSOP-T[5],

TFBGA, VFBGA

not suitable

suitable

−

DHVQFN, HBCC, HBGA,

HLQFP, HSQFP, HSOP,

HTQFP, HTSSOP,

HVQFN, HVSON, SMS

not suitable[6]

suitable

−

PLCC[7], SO, SOJ

suitable

−

LQFP, QFP, TQFP

not recommended[7][8]

suitable

−

SSOP, TSSOP, VSO,

VSSOP

not recommended[9]

suitable

−

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