MCP2003B-HSLASHMF datasheet(17/32 Pages) MICROCHIP

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 2015-2016 Microchip Technology Inc.

DS20005463C-page 17

MCP2003B

3.0

PACKAGING INFORMATION

3.1

Package Marking Information

8-Lead SOIC (150 mil)

Examples:

Examples

8-Lead DFN (2x3)

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

Examples

8-Lead DFN (3x3)

NNN

ADP

613

DAEC

1613

256

MCP2003B

SN^^^1613

256

Device

Code

MCP2003B-E/MC

ADP

MCP2003BT-E/MC

ADP

MCP2003B-H/MC

ADR

MCP2003BT-H/MC

ADR

Device

Code

MCP2003B-E/MF

DAEC

MCP2003BT-E/MF

DAEC

MCP2003B-H/MF

DAEE

MCP2003BT-H/MF

DAEE

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