MP604 datasheet(5/6 Pages) FORMOSA

5 / 6 page

Profile Feature

Soldering Condition

Average ramp-up rate(TL to TP)

<3 C/sec

Preheat

-Temperature Min(Tsmin)

100 C

-Temperature Max(Tsmax)

150 C

-Time(min to max)(ts)

60~120sec

Tsmax to TL

-Ramp-upRate

<3 C/sec

Time maintained above:

-Temperature(TL)

183 C

-Time(tL)

60~150sec

Peak Temperature(TP)

255 C-0/+5 C

Time within 5 C of actual Peak

Temperature(tP)

Ramp-down Rate

<6 C/sec

Time 25 C to Peak Temperature

<6minutes

3.Flow (wave)soldering (solder dipping)

1.Storage environment: Temperature=10 C~35 C Humidity=65%±15%

2.Reflow soldering of surface-mount devices

10~30sec

Suggested thermal profiles for soldering processes

Page 5

Preheat

Ramp-up

Critical Zone

to TP

Tsmax

Tsmin

t25 C to Peak

Ramp-down

Time

Wave Soldering

IR Reflow

Bridge Rectifier

Formosa MS

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

MP6005 THRU MP610

Document ID

Issued Date

RevisedDate

Revision

Page.

DS-242146

2009/08/10

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