INA118

SBOS027A – SEPTEMBER 2000 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

±18

V

Analog input voltage

±40

V

Output short-circuit (to ground)

Continuous

Operating temperature

–40

125

°C

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Storage temperature

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V

Power supply

±2.25

±15

±18

V

Input common-mode voltage

V

Ambient temperature

–55

150

°C

6.4 Thermal Information

INA118

D (SOIC)

P (PDIP)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

115

48

°C/W

Junction-to-case (top) thermal resistance

62

37

°C/W

Junction-to-board thermal resistance

59

25

°C/W

Junction-to-top characterization parameter

14

14

°C/W

Junction-to-board characterization parameter

58

25

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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