74LVC2G02 datasheet(5/11 Pages) DIODES

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74LVC2G02

Document number: DS37927 Rev 1 - 2

5 of 11

www.diodes.com

June 2016

74LVC2G02

Operating Characteristics

Parameter

Test

Conditions

VCC = 1.8V

VCC = 2.5V

VCC = 3.3V

VCC = 5V

Unit

Typ.

Cpd

Power Dissipation

Capacitance

f = 10MHz

Package Characteristics

Symbol

Parameter

Package

Test Conditions

Min

Typ.

Max

Unit

θJA

Thermal Resistance Junction-

to-Ambient

X2-DFN2010-8

(Note 10)

—

313

—

°C/W

X2-DFN1410-8

—

321

—

X2-DFN1210-8

—

395

—

θJC

Thermal Resistance Junction-

to-Case

X2-DFN2010-8

(Note 10)

—

145

—

°C/W

X2-DFN1410-8

—

166

—

X2-DFN1210-8

—

236

—

Note:

10. Test condition for each package type: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.

Switching Characteristics

Typical Values at TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V. See Figure 1.

Parameter

From

Input

Output

VCC

TA = -40°C to +85°C

TA = -40°C to +125°C

Unit

Min

Typ

Max

Min

Max

tpd

A or B

1.8V ± 0.15V

1.2

3.8

8.9

1.2

11.2

2.5V ± 0.2V

0.8

2.4

5.4

0.8

6.8

2.7V

0.8

3.2

6.0

0.8

7.5

3.3V ± 0.3V

0.6

2.4

4.9

0.6

6.2

5.0V ± 0.5V

0.6

1.8

4.3

0.6

5.5

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