MPC8272 datasheet(51/56 Pages) MOTOROLA

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MPC8272 PowerQUICC II™ Family Hardware Speciﬁcations

MOTOROLA

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

Package

Figure 13 shows the side proﬁle of the PBGA package.

Figure 13. Side View of the PBGA Package Remove

Table 20 provides package parameters. Figure 14 provides the mechanical dimensions and bottom surface

nomenclature of the 516 PBGA package.

NOTE: Temperature Reﬂow for the VR Package

In the VR package, sphere composition is lead-free (refer to Table 2). This

requires higher temperature reﬂow than what is required for other

PowerQUICC II packages. Users should consult “Motorola PowerQUICC II™

Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at

www.motorola.com/semiconductors.

Table 20. Package Parameters

Code

Type

Outline

(mm)

Interconnects

Pitch

(mm)

Nominal Unmounted

Height (mm)

VR, ZQ

PBGA

27 x 27

516

2.25

Die

Transfer molding compound

1 mm pitch

Wire bonds

attach

DIE

Ball bond

Screen-printed

solder mask

Cu substrate traces

Resin glass epoxy

Plated substrate via

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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