MSC1210 datasheet(2/83 Pages) TI

2 / 83 page

MSC1210

SBAS203F − MARCH 2002 − REVISED NOVEMBER 2004

www.ti.com

PACKAGE/ORDERING INFORMATION(1)

PRODUCT

FLASH MEMORY

PACKAGE-LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE RANGE

PACKAGE

MARKING

MSC1210Y2

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y2

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y2

MSC1210Y3

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y3

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y3

MSC1210Y4

16k

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y4

16k

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y4

MSC1210Y5

32k

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y5

32k

TQFP-64

PAG

−40

°C to +85°C

MSC1210Y5

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or refer to our web site at www.ti.com.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS(1)

MSC1210Yx

UNITS

Analog Inputs

Input current

Momentary

100

Input current

Continuous

Input voltage

AGND − 0.3 to AVDD + 0.3

Power Supply

DVDD to DGND

−0.3 to +6

AVDD to AGND

−0.3 to +6

AGND to DGND

−0.3 to +0.3

VREF to AGND

−0.3 to AVDD + 0.3

Digital input voltage to DGND

−0.3 to DVDD + 0.3

Digital output voltage to DGND

−0.3 to DVDD + 0.3

Maximum junction temperature

150

°C

Operating temperature range

−40 to +85

°C

Storage temperature range

−65 to +150

°C

Lead temperature (soldering, 10s)

+235

°C

Package power dissipation

(TJ Max − TAMBIENT)/qJA

Output current, all pins

200

Output pin short-circuit

Junction to ambient (

qJA)

High K (2s 2p)

62.9

°C/W

Thermal Resistance

Junction to ambient (

qJA)

Low K (1s)

78.2

°C/W

Thermal Resistance

Junction to case (

qJC)

13.8

°C/W

Digital Outputs

Output current

Continuous

100

I/O source/sink current

100

Power pin maximum

300

(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for

extended periods may affect device reliability.

MSC1210YX FAMILY FEATURES

FEATURES(1)

MSC1210Y2(2)

MSC1210Y3(2)

MSC1210Y4(2)

MSC1210Y5(2)

Flash Program Memory (Bytes)

Up to 4k

Up to 8k

Up to 16k

Up to 32k

Flash Data Memory (Bytes)

Up to 4k

Up to 8k

Up to 16k

Up to 32k

Internal Scratchpad RAM (Bytes)

256

Internal MOVX RAM (Bytes)

1024

Externally Accessible Memory (Bytes)

64k Program, 64k Data

(1) All peripheral features are the same on all devices; the flash memory size is the only difference.

(2) The last digit of the part number (N) represents the onboard flash size = (2N)kBytes.

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