If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (V

4.1V

DC Input Voltage (V

−0.5V to V

DC Output Voltage (V

−0.5V to V

Storage Temperature Range

(T

−65˚C to +150˚C

Lead Temperature (T

(Soldering 10 sec.)

260˚C

ESD Rating:

(C

MM = 200V, HBM = 2000V

Operating Conditions

Min

Max

Units

Supply Voltage (V

3.0

3.6

V

Operating Temp. Range (T

0

70

˚C

Note 1: “Absolute Maximum Ratings” are those values beyond which the

safety of the device cannot be guaranteed. They are not meant to imply that

the devices should be operated at these limits. The table of “Electrical Char-

acteristics” specifies conditions of device operation.

Symbol

Parameter

Conditions

Min

Max

Units

V

OH

Minimum High Level

Output Voltage

V

2.4

V

V

OL

Maximum Low Level

Output Voltage

V

0.4

V

V

IH

Minimum High Level

Input Voltage

2.0

V

V

IL

Maximum Low Level

Input Voltage

0.8

V

I

IN

Input Current

V

10

µA

I

OZ

Maximum TRI-STATE

Output Leakage Current

V

10

µA

I

DD

Average Supply Current

f = 65 MHz, C

312

mA

V

THH

Differential Input High

Threshold

Common Mode Voltage = +1.2V

+100

mV

V

THL

Differential Input Low

Threshold

Common Mode Voltage = +1.2V

-100

mV

Symbol

Parameter

Conditions

Min

Max

Units

RPLLS

Receiver Phase Lock Loop Set Time

10

ms

RCCS

RxIN Channel-to-Channel Skew (Note 2)

700

ps

Note 2: This limit assumes a maximum cable skew of 350 ps. Actual automated test equipment limit is 400 ps due to tester accuracy.

DS101086-12

FIGURE 1. FPD85310 (Receiver) Phase Lock Loop Set Time

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