Thermal Pad Mechanical Data

DGN (S–PDSO–G8)

www.ti.com

1

THERMAL INFORMATION

The DGN PowerPAD

™ package incorporates an exposed thermal die pad that is designed to be attached directly

to an external heat sink. When the thermal die pad is soldered directly to the printed circuit board (PCB), the PCB

can be used as a heatsink. In addition, through the use of thermal vias, the thermal die pad can be attached directly

to a ground plane or special heat sink structure designed into the PCB. This design optimizes the heat transfer from

the integrated circuit (IC).

For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities, refer to

Technical Brief,

PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and

Application Brief, PowerPAD Made Easy, Texas Instruments Literature No. SLMA004. Both documents are available

at www.ti.com. See Figure 1 for DGN package exposed thermal die pad dimensions.

Exposed Thermal

Die Pad

Bottom View

PPTD041

NOTE: All linear dimensions are in millimeters.

8

5

1

4

1,78

MAX

1,73

MAX

Figure 1. DGN Package Exposed Thermal Die Pad Dimensions

PowerPAD is a trademark of Texas Instruments.