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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com

SPECIFICATIONS ARE SUBJECT TO CHANGE

Surface Mount UV LED

NUVC66 Precautions

Usage:

1. The LED should not come into direct contact with hazardous materials such as sulfur, chlorine, phthalate, etc.

2. The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to corrosive gases

must be avoided during operation and storage.

3. The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of the end-

products but by the gases penetrated from outside environment.

4. Extreme environments such as sudden ambient temperature changes or high humidity that can cause

condensation must be avoided.

5. Do not directly look at the light when the LEDs are on. Proceed with caution to avoid the risk of damage to the

eyes when examining the LEDs with optical instruments.

Cleaning:

1. Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as they may damage the

resin of the LEDs.

2. Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following conditions.

3. Cleaning Condition : IPA, 25°C max. × 60sec max.

4. Ultrasonic cleaning is

not recommended.

5. Pretests should be conducted with the actual cleaning process to validate that the process will not damage the

LEDs.

Manual handling and soldering:

1. Use Teflon-type tweezers to grab the base of the LED and do not apply mechanical pressure on the surface of the

encapsulant.

2. The recommended soldering iron condition is 260°C for <5 seconds. For higher temperatures a short contact time

is required (reduce duration 1 second for every 10°C increase in temperature).

3. The power dissipation of the soldering iron should be lower than 15W and the surface temperature of the device

should be controlled to < 230°C