IRK.56, .71 Series

3

Bulletin I27140 rev. E 10/02

www.irf.com

T

J

Junction temperature range

-40 to 150

°C

Storage temperature range

-40 to 150

°C

R

thJC

Max. thermal resistance,

junction to case

R

thCS

Typical thermal resistance,

Mounting surface flat, smooth and greased

case to heatsink

T

Mounting tourque ±10%

to heatsink

5

busbar

4

wt

Approximate weight

110 (4)

gr (oz)

Case style

TO-240AA

JEDEC

Parameter

IRK.56

IRK.71

Units

Conditions

0.5

0.4

K/W

Per junction, DC operation

Thermal and Mechanical Specifications

A mounting compound is recommended and the

torque should be rechecked after a period of 3 hours

to allow for the spread of the compound

Nm

0.1

K/W

Sine half wave conduction

Rect. wave conduction

Devices

Units

IRK.56

0.11

0.13

0.16

0.22

0.32

0.09

0.14

0.17

0.23

0.32

IRK.71

0.06

0.08

0.11

0.14

0.21

0.06

0.09

0.11

0.15

0.21

°C/W

∆R Conduction (per Junction)

(The following table shows the increment of thermal resistance R

thJC

when devices operate at different conduction angles than DC)

IRK

D

71

/

16

A

1

2

3

Device Code

4

Ordering Information Table

1

-

Module type

2

-

Circuit configuration (See Circuit Configuration Table)

3

-

Current code

4

-

Voltage code (See Voltage Ratings Table)

5

-

A: Gen V

5