Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

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Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.

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Cree PLCC6 3 in 1 SMD LED

CLX6D-FKB

REFLOW SOLDERING

•

TheCLX6D-FKBisratedasaMSL5aproduct.

•

Therecommendedfloorlifeoutofbagis24hrs.

•

•

Thetemperatureprofileisasbelow.

Use only with CLX6D-FKB

Solderingpad:

Solder

Average ramp-up rate = 4ºC/s max

Preheat temperature = 150ºC ~200ºC

Preheat time = 120s max

Ramp-down rate = 6ºC/s max

Peak temperature = 250ºC max

Time within 5ºC of actual Peak Temperature = 10s max

Duration above 217ºC is 60s max

Document No.: COTCO-05-0057

Rev. NO.:

13

6/9

Melting-point

Pre-heat

Soak

Reflow

Cooling

Time

Use all SMD besides LP6-NPP1-01-N1

Solder = Sn63-Pb37

Solder = Lead-free

Average ramp-up rate =4ºC/s max.

Average ramp-up rate =4ºC/s max

Preheattemperature = 100ºC ~150ºC

Preheattemperature = 150ºC ~200ºC

Preheattime = 100s max.

Preheattime = 100s max.

Ramp-down rate =6ºC/s max.

Ramp-down rate =6ºC/s max.

Peaktemperature = 230ºC max.

Peaktemperature = 250ºC max.

Time within5ºC of actual Peak Temperature = 10s max.

Time within5ºC of actual Peak Temperature = 10s max.

Duration above 183ºC is 80s max.

Duration above 217ºC is 80s max.

Only use LP6-NPP1-01-N1

[13]

Solder = Low Lead-free

Average ramp-up rate =3ºC/s max.

Preheattemperature = 130ºC ~170ºC

Preheattime = 120s max.

Ramp-down rate =6ºC/s max.

Peaktemperature = 213ºC max.

Time within3ºC of actual Peak Temperature = 25s max.

Duration above 200ºC is 40s max.

Recommended solder pad designfor heat dissipation (2-pin SMD LED):

7.0

2.6

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Recommended solder pad designfor heat dissipation (4-pin SMD LED)

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