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MRF24WN0MB 데이터시트(PDF) 10 Page - Microchip Technology

부품명 MRF24WN0MB
상세설명  2.4 GHz IEEE 802.11b/g/n Wireless Module
PDF  36 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MRF24WN0MB 데이터시트(HTML) 10 Page - Microchip Technology

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MRF24WN0MA/MB
DS50002410A-page 10
Advance Information
 2015 Microchip Technology Inc.
FIGURE 1-7:
MRF24WN0MA/MB HOST PCB EXAMPLE LAYOUT
1.3
Soldering Recommendations
The MRF24WN0MA/MB wireless module was assem-
bled using the IPC/JEDEC J-STD-020 Standard lead-
free reflow profile. The MRF24WN0MA/MB module
can be soldered to the host PCB using standard leaded
and lead-free solder reflow profiles.
To avoid damaging the module, adhere to the following
recommendations:
• Solder reflow recommendations are provided in
the Microchip Application Note, AN233 "Solder
Reflow Recommendation" (DS00233)
• Do not exceed a peak temperature (TP) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations from the vendor
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Best
Okay
Okay
Okay
No Copper
in these Areas



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