TLV2760, TLV2761, TLV2762, TLV2763, TLV2764, TLV2765

FAMILY OF 1.8 V MICROPOWER RAIL-TO-RAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUT DOWN

SLOS326D – JUNE 2000 – REVISED FEBRUARY 2001

17

POST OFFICE BOX 655303

APPLICATION INFORMATION

general power dissipation considerations (continued)

1

0.75

0.5

0

–55 –40 –25 –10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA – Free-Air Temperature – °C

2

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 35. Maximum Power Dissipation vs Free-Air Temperature