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DESCRIPTION (CONTINUED)

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS TABLE

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TPS65130, TPS65131

SLVS493B – MARCH 2004 – REVISED SEPTEMBER 2004

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

The converter operates with a fixed frequency PWM control topology and, if power-save mode is enabled, it uses

a pulse-skipping mode at light load currents. It operates with only 500-µA device quiescent current. Independent

enable pins allow power up and power down sequencing for both outputs. The device has an internal current

limit overvoltage protection and a thermal shutdown for highest reliability under fault conditions.

ORDERING INFORMATION

SWITCH CURRENT LIMIT

BOOST CONVERTER

INVERTING CON-

VERTER

–40

°C to 85°C

800 mA

800 mA

TPS65130RGE

–40

°C to 85°C

1950 mA

1950 mA

TPS65131RGE

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The RGE package is availabletaped and reeled. Add an R suffix to the device type (i.e.,

TPS65130RGER) toorder quantities of 3000 devices per reel. It is also available in minireels. Add a T

suffix to the device type (i.e., TPS65130RGET) toorder quantities of 250 devices per reel.

TPS65130/1

VIN, INN

–0.3 V to +6.0 V

VPOS

17 V

VNEG

–17 V

INP

17 V

24 V

Operating virtual junction temperature

–40

°C to 150°C

Storage temperature range

–65

°C to 150°C

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Stresses beyond those listedunder "absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings

only, and functional operation of the deviceat these or any other conditions beyond those indicated under "recommendedoperating

conditions” is not implied. Exposure to absolute-maximum-ratedconditions for extended periods may affect device reliability.

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All voltage values are withrespect to network ground terminal, unless otherwisenoted.

DERATING FACTOR

PACKAGE

Θ

JA

Θ

JB

Θ

JC

POWER RATING

POWER

POWER RATING

RATING

RGE

37.8

°C/W 27.8 °C/W 57.9 °C/W

2646 mW

26 mW/

°C

1455 mW

1058 mW

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This thermal data is based on assembly of the device on a JEDEC high K board. The PowerPAD must be soldered on a pad on the

board. There must be vias within the pad that contact the ground plane in the PCB. Exceeding the maximum junctiontemperature will

force the device into thermalshutdown.

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