cui.com

date 09/08/2016

│ page 2 of 4

CUI Inc

│ SERIES: CP08-M │ DESCRIPTION: PELTIER MODULE

SPECIFICATIONS

parameter

conditions/description

min

typ

max

units

8.865

9.85

10.835

Ω

solder melting temperature

connection between thermoelectric pairs

235

°C

assembly compression

0.8

MPa

hot side plate

80

°C

RoHS

2011/65/EU

Note:

1. Measured by AC 4-terminal method at 25°C

MECHANICAL DRAWING

units: mm

COLD SIDE

HOT SIDE

0.05

0.05

THICKNESS

COLD SIDE

Black (-)

Red (+)

WIDTH

LENGTH

100.0 5.0

10 3.0

MATERIAL

PLATING

ceramic plate

96% AL

wire leads

28AWG

tin

sealer

siliconrubber703RTV(betweencold

and hot side plates)

joint cover

siliconrubber703RTV

marking

P/N & S/N printed on cold side

surface

MODEL NO.

LENGTH

(mm)

WIDTH

(mm)

THICKNESS

(mm)

CP081030-M

10 ±0.3

10 ±0.3

3.0 ±0.1

For more information, please visit the product page.