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RN4870 데이터시트(PDF) 21 Page - Microchip Technology |
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RN4870 데이터시트(HTML) 21 Page - Microchip Technology |
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21 / 48 page ![]() 2016 Microchip Technology Inc. DS50002489A-page 21 RN4870/71 FIGURE 4-13: RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST PCB BOARD 4.5 Soldering Recommendations The RN4870/71 Bluetooth modules are assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, the following recom- mendations are given: • Microchip Technology Application Note, “AN233 Solder Reflow Recommendation” (DS00233) provides solder reflow recommendations •Do not exceed peak temperature (TP) of 250°C • Refer to the solder paste data sheet for specific reflow profile recommendations • Use no-clean flux solder paste •Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Acceptable Best Acceptable Lowest performance |
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