©2014 Silicon Storage Technology, Inc.

DS-70005004G

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12

2.4 GHz High-Efficiency, High-Gain Power Amplifier Module

SST12LP17E

Data Sheet

Packaging Diagrams

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14006A Sheet 1 of 1

8-Lead Ultra Thin Small Outline No-Leads (QU8E/F) - 2x2 mm Body [USON]

Note:

1. Similar to JEDEC JEP95 XQFN/XSON variants, though number of contacts and some dimensions are different.

2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown.

3. From the bottom view, the pin #1 indicator may be either a curved indent or a 45-degree chamfer.

4. The external paddle is electrically connected to the die back-side and to VSS.

This paddle must be soldered to the PC board; it is required to connect this paddle to the VSS of the unit.

Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device.

5. Untoleranced dimensions are nominal target dimensions.

6. All linear dimensions are in millimeters (max/min).