©2014 Silicon Storage Technology, Inc.

DS70005029C

07/15

26

2.4 GHz WLAN 802.11b,g,n, 256 QAM Power Amplifier

SST12LP15B

Data Sheet

Packaging Diagrams

Figure 26:16-contact Very-thin Quad Flat No-lead (VQFN)

Package Code: QVC

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-14015A Sheet 1 of 1

16-Lead Very Thin Quad Flatpack No-Leads (QVCE/F) - 3x3 mm Body [VQFN]

16-vqfn-3x3-QVC-2.0

Note:

1.

Complies with JEDEC JEP95 MO-220J, variant VEED-4 except external paddle nominal dimensions.

2.

From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

3.

The external paddle is electrically connected to the die back-side and possibly to certain VSS leads.

This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit.

Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.

4.

Untoleranced dimensions are nominal target dimensions.

5.

All linear dimensions are in millimeters (max/min).