TO-220

Plastic Package

3-Lead SOT-223

00906707

Front View

Order Number LM337T

See NS Package Number T03B

00906734

Front View

Order Number LM337IMP

Package Marked N02A See NS Package Number MP04A

Application Hints

When a value for

θ

a heatsink must be selected that has a value that is less than

or equal to this number.

HEATSINKING SOT-223 PACKAGE PARTS

The SOT-223 (“MP”) packages use a copper plane on the

PCB and the PCB itself as a heatsink. To optimize the heat

sinking ability of the plane and PCB, solder the tab of the

package to the plane.

Figures 3, 4 show the information for the SOT-223 package.

Figure 4 assumes a

θ

51˚C/W for 2 ounce copper and a maximum junction tem-

perature of 125˚C.

Please see AN1028 for power enhancement techniques to

be used with the SOT-223 package.

00906732

FIGURE 3.

θ

SOT-223 Package

00906733

FIGURE 4. Maximum Power Dissipation vs. T

the SOT-223 Package

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