DS507PP1

21

EP7309

High-Performance, Low-Power System on Chip

Packages

208-Pin LQFP Package Characteristics

208-Pin LQFP Package Specifications

Note:

1) Dimensions are in millimeters (inches), and controlling dimension is millimeter.

2) Drawing above does not reflect exact package pin count.

3) Before beginning any new design with this device, please contact Cirrus Logic for the latest package information.

4) For pin locations, please see Figure 11. For pin descriptions see the EP7309 User’s Manual.

Figure 10. 208-Pin LQFP Package Outline Drawing

Pin 1 Indicator

29.60 (1.165)

30.40 (1.197)

0.17 (0.007)

0.27 (0.011)

27.80 (1.094)

28.20 (1.110)

0.50

(0.0197)

BSC

29.60 (1.165)

30.40 (1.197)

27.80 (1.094)

28.20 (1.110)

1.35 (0.053)

1.45 (0.057)

0

° MIN

7

° MAX

0.09 (0.004)

0.20 (0.008)

1.40 (0.055)

0.45 (0.018)

0.75 (0.030)

0.05 (0.002)

1.00 (0.039) BSC

Pin 1

Pin 208

1.60 (0.063)

0.15 (0.006)

EP7309

208-Pin LQFP