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MCP8063-E/MD 데이터시트(PDF) 5 Page - Microchip Technology |
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MCP8063-E/MD 데이터시트(HTML) 5 Page - Microchip Technology |
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5 / 20 page ![]() 2014 Microchip Technology Inc. DS20005257B-page 5 MCP8063 FIGURE 1-1: Allowable Power Dissipation (PD_MAX) as a Function of Ambient Temperature (TA). Thermal Shutdown TSD — 170 — °C Thermal Shutdown Hysteresis TSD_HYS —25 — °C Input Over Voltage VOV —18.5 — V TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 12.0V, TA =+25°C. Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature TOPR -40 — +125 °C Storage Temperature Range TSTG -55 — +150 °C Package Thermal Resistances Thermal Resistance, 8LD 4x4 DFN JA —48 — °C/W JC —7 — °C/W Note 1: Minimum and maximum parameter is not production tested and is specified by design and validation. Derating applies for ambient temperatures outside the specified operating range (refer to Figure 1-1). ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 12.0V, Temperature = +25°C. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: Minimum and maximum parameter is not production tested and is specified by design and validation. Reference PCB, according to JEDEC standard EIA/JESD 51-9. 0 0.5 1 1.5 2 2.5 T A (°C) DFN-8 |
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