28-Lead PDIP (.600in Row Spacing) Package Outline (P)

1.565x.580in body, .250in height (max), .100in pitch

Note 1

(Index Area)

28

1

D

L

A1

A

A2

Seating

Plane

e

E1

D1

D1

E

A

A

Side View

Top View

View A - A

eA

eB

b

b1

View B

View B

Note:

1.

Symbol

A

A1

A2

b

b1

D

D1

E

E1

e

eA

eB

L

Dimension

(inches)

MIN

.140*

.015

.125

.014

.030

1.380

.485

.100

BSC

.600

BSC

.600*

.115

NOM

-----

-

-

-

-

-

-

MAX

.250

.055*

.195

.070

1.565

.085*

.625

.580

.700

.200

Drawings not to scale.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

 2016 Microchip Technology Inc.

DS20005629A-page 9

HV5812