2

Selection Guide

8-Pin DIP (300 Mil)

Small Outline SO-8

Single Channel

Dual Channel

Single Channel

Dual Channel

Minimum Input

Package HCPL-

Package HCPL-

Package HCPL-

Package HCPL-

Minimum CTR

270L

273L

070L

073L

0.5 mA

400%

1.6 mA

300%

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-270L #XXX

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Agilent sales representative

or authorized distributor for information.

Schematic

The HCPL-070L and HCPL-073L

are surface mount devices

packaged in an industry standard

SOIC-8 footprint.

The SOIC-8 does not require

"through holes" in a PCB. This

package occupies approximately

one-third the footprint area of the

standard dual-in-line package.

The lead profile is designed to be

compatible with standard surface

mount processes.

IF2

6

5

GND

3

4

VO2

VF2

IO2

+

–

IF1

8

7

V

CC

1

2

V

O1

ICC

V

F1

IO1

–

+

SHIELD

USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED

BETWEEN PINS 5 AND 8 IS RECOMMENDED

HCPL-270L/HCPL-070L

HCPL-273L/HCPL-073L

IF

8

VCC

2

3

ICC

VF

ANODE

CATHODE

+

–

VB

IB

6

5

GND

VO

IO

7

SHIELD