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LCMC 데이터시트(PDF) 13 Page - AVX Corporation

부품명 LCMC
상세설명  Multi-Layer Ceramic Chip Inductors LCMC Series
PDF  13 Pages
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제조업체  AVX [AVX Corporation]
홈페이지  http://www.avx.com
Logo AVX - AVX Corporation

LCMC 데이터시트(HTML) 13 Page - AVX Corporation

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20
Quantity per reel
0201: 15,000 pieces / reel
0402: 10,000 pieces / reel
0603: 4,000 pieces / reel
The contents of a box
0201: 5 reels / box
0402: 5 reels / box
0603: 5 reels / box
Marking
The following item shall be marked on the reel.
a. Manufactures parts number.
b. Manufacturing date code.
c. Manufacturer name.
d. Manufactures lot number.
e. Quantity.
CAUTIONS
Storage
The chip inductor shall be packaged in carrier tapes.
To keep storage place temperature from +5 to 35ºC,
humidity from 45 to 70% RH.
The storage atmosphere must be free of gas containing
sulfur and chlorine. Also, avoid exposing the product to
saline moisture. If the product is exposed to such
atmospheres, the terminals will oxidize and solderability will
be affected.
The solderability is assured for 12 months from our final
inspection date if the above storage condition is followed.
Handling
Chip inductor should be handled with care to avoid
contamination or damage. The use of vacuum pick-up or
plastic tweezers is recommended for manual placement.
Tape and reeled packages are suitable for automatic pick
and placement machine.
Recommended pad dimensions
Soldering Profile for SMT Process with SnPb
Solder Paste
The rate of preheat should not exceed 4ºC/sec. and a target
of 2ºC/sec. is preferred. Ceramic chip components should
be preheated to within 100 to 130ºC of the soldering.
Soldering Profile for SMT Process with Lead
Free Solder Paste
The rate of preheat should not exceed 4ºC/sec. and a target
of 2ºC/sec. is preferred. Ceramic chip components should
be preheated to within 100 to 130ºC of the soldering.
Soldering
220°C to 230°C
5 ~ 10 sec.
Gradual
Natural Cooling
Preheating
over 1 min
over 1 min
Time (sec.)
Over 200°C, within 40 sec.
120 sec max
300
200
0
250
Soldering
240°C to 260°C
5 ~ 10 sec.
Gradual
Natural Cooling
Preheating
over 1 min
over 1 min
Time (sec.)
Over 200°C, within 90 sec.
120 sec max
0
300
200
250
c
a
b
Soldering resist
SMD Inductor
Land Pattern
Size (EIA)
L x W
a
b
c
0201
0.60 x 0.30
0.15 to 0.35
0.20 to 0.30
0.25 to 0.30
(0.024 x 0.012)
(0.006 to 0.014)
(0.008 to 0.012)
(0.010 to 0.012)
0402
1.00 x 0.50
0.30 to 0.50
0.35 to 0.45
0.40 to 0.50
(0.039 x 0.020)
(0.012 to 0.020)
(0.014 to 0.018)
(0.016 to 0.020)
0603
1.60 x 0.80
0.70 to 1.00
0.60 to 0.80
0.70 to 0.80
(0.063 x 0.031)
(0.028 to 0.039)
(0.024 to 0.031)
(0.028 to 0.031)
mm (inches)
Multi-Layer High Frequency
Ceramic Chip Inductors
LCMC Series



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