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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F071X8 데이터시트(PDF) 97 Page - STMicroelectronics |
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STM32F071X8 데이터시트(HTML) 97 Page - STMicroelectronics |
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97 / 122 page  DocID025451 Rev 5 97/122 STM32F071x8 STM32F071xB Package information 118 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA100 package information UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array package. Figure 34. UFBGA100 package outline 1. Drawing is not to scale. Table 70. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 0.600 - - 0.0236 A1 - - 0.110 - - 0.0043 A2 - 0.450 - - 0.0177 - A3 - 0.130 - - 0.0051 0.0094 A4 - 0.320 - - 0.0126 - |
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