STM32F412RG datasheet(114/193 Pages) STMICROELECTRONICS

114 / 193 page

Electrical characteristics

STM32F412xE/G

114/193

DocID028087 Rev 4

The test results are given in Table 52. They are based on the EMS levels and classes

defined in application note AN1709.

When the application is exposed to a noisy environment, it is recommended to avoid pin

exposition to disturbances. The pins showing a middle range robustness are: PA0, PA1,

PA2, on LQFP144 packages and PDR_ON on WLCSP49.

As a consequence, it is recommended to add a serial resistor (1 k

Ω maximum) located as

close as possible to the MCU to the pins exposed to noise (connected to tracks longer than

50 mm on PCB).

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015).

Table 51. EMS characteristics for LQFP144 package

Symbol

Parameter

Conditions

Level/

Class

VFESD

Voltage limits to be applied on any I/O pin

to induce a functional disturbance

VDD = 3.3 V, LQFP144

TA = +25 °C, fHCLK = 100 MHz,

conforms to IEC 61000-4-2

VEFTB

Fast transient voltage burst limits to be

applied through 100 pF on VDD and VSS

pins to induce a functional disturbance

VDD = 3.3 V, LQFP144

TA = +25 °C, fHCLK = 100 MHz,

conforms to IEC 61000-4-4

STM32F412RG 데이터시트(PDF) 114 Page - STMicroelectronics

STM32F412RG 데이터시트(HTML) 114 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

데이터시트 다운로드

링크 URL