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STSPIN230 데이터시트(PDF) 20 Page - STMicroelectronics |
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STSPIN230 데이터시트(HTML) 20 Page - STMicroelectronics |
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20 / 22 page ![]() Package information STSPIN230 20/22 DocID029312 Rev 4 Figure 12. VFQFPN 3x3x1.0 16L recommended footprint Table 9. VFQFPN 3x3x1.0 16L package mechanical data Symbol Dimensions (mm) NOTES Min. Typ. Max. A 0.80 0.90 1.00 (1) 1. VFQFPN stands for “Thermally Enhanced Very thin Fine pitch Quad Packages No lead”. Very thin: 0.80 < A ≤ 1.00 mm / fine pitch: e < 1.00 mm. The pin #1 identifier must be present on the top surface of the package by using an indentation mark or an other feature of the package body. A1 0.02 A3 0.20 b 0.18 0.25 0.30 D 2.85 3.00 3.15 D2 1.70 1.80 1.90 E 2.85 3.00 3.15 E2 1.70 1.80 1.90 e0.50 L 0.45 0.50 0.55 |
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